In our daily lives, we all rely on a variety of different things. To give one example, the vast majority of us have access to and routinely make use of automobiles. If something is used frequently, sooner or later it will break down and need fixing or maintenance. Similar considerations apply to Ball Grid Arrays, which may require a rework BGA procedure at some point.
BGA Rework Station
Rework stations for Ball Grid Arrays (BGAs) are used to fix faulty printed circuit boards in SMDs. In addition to BGA rework station, SMD rework station and SMT rework station are some of the other names for this tool. PCB technicians fix the boards by using a BGA rework station. It’s important to take the time to inspect every component and replace any that are broken or missing before installing new ones.
Reworking BGA: Detailed Steps
You’ll need a thick iron wire, such that found in a wire clothes hanger, along with clippers, a hot air gun, flux soldering, and scrap iron strips. These can be salvaged from broken pallets used to transport goods.
- Step 1
The BGA chip you have will need precise measurements. After measuring out the required length, you can use a hammer and a vise to shape the strip into a square. You could alternatively bend the strip with a pair of tweezers, or you could combine a pair of pliers with a wrench and grip for a more efficient method of completing the task.
In any instance, the square that you construct should be somewhat larger than the original BGA chip that you own. This will enable heat to pass underneath the chip body and prevent it from becoming trapped.
- Step 2
In this step of the process, you will need to fashion a clip out of some iron wire that you have available to you. Once you have created your clip, you should put it to the side for later use since you will require it in the future to hold all of the individual sections and components together.
- Step 3
After you’ve had your fill of soda, it’s time to open the can using a pair of shears or a cutter. Next, lay the can down and make a square opening in its side. The hole must be square so that the square framework you built in Step 1 will fit snugly inside it.
As soon as you begin warming up the chip with your hot air pistol, you should be able to protect the other components of your circuit board from excessive heat by using the aluminum foil that is attached to your soda can. If you’ve followed the instructions for the heater, you shouldn’t have any trouble.
- Step 4
At this stage, it is necessary for the soldering flux to permeate the actual BGA chip. Using a little brush and being sure to cover all angles can help your cause.
- Step 5
The next step is rolling a tiny bit of your tin solder into a tiny ball. After that, put your ball somewhere safe; you’ll need to check on it again while it’s being heated.
- Step 6
You’ll want to secure the circuit board to your workbench so it doesn’t slide around while you’re soldering. Make sure the chip is raised off the tabletop so that you can easily heat it from underneath.
This will allow you to get the most out of the heat. Following this step, you will need to grab your square frame as well as your aluminum foil and secure them into place using the wire clip that you fashioned at the outset of your project.
Put the little metal ball into the center of the BGA chip. Once the tin solder ball has melted, the board must be placed in such a way that it cannot roll away.
- Step 7
The heating process is here, and it is the most exciting phase. To get things heated up, break out the hot air cannon and start it on a low heat setting. At this point, you’ll want to use both top and bottom heat to get the tin glob to melt.
Once it’s melted, keep the area toasty for at least 30 more seconds. When the tin has melted completely, it will form a shiny metal ball, and if you don’t do the things we’ve suggested, it will roll away.
An additional piece of advice is to try holding the gun horizontally to the board, above the chip, with an acceptable distance between the chip and the hot air pistol; if done correctly, the tin ball will stay on your chip rather than dropping to the floor.
- Step 8
Lastly, the board must be cooled. Your board has to be totally redesigned after it has cooled down. In this way, it will be saved from the dumpster and the subsequent trip to the landfill, where it could have ended up having a much shorter lifespan.